KLD-LGA72 BI Socket
The LGA72 power chip HTOL/HAST reliability test socket is designed for 72-pad LGA package power management chip (PMIC)/DC-DC converter and is specially used for high temperature operating life (HTOL) and high accelerated temperature and humidity stress (HAST) reliability verification. The test socket is made of high-temperature resistant engineering plastics and high-precision spring probes, which maintain stable contact in a wide temperature range of -55°C to 175°C, meeting the reliability testing requirements of industrial-grade, automotive-grade and even military-grade chips.
| Contact Resistance | ≤50mΩ |
| Lifespan | ≥1000HX5轮 |
Product Details
① Main body material: PEEK ceramic/Torlon/PEI and other engineering plastics, resistant to extreme temperatures from -55℃ to 175℃
② Probe material: Beryllium copper alloy plated with gold, thickened gold plating layer on contacts, low contact resistance, high reliability
③ Gold plating thickness: Thickened electroplating on probe contacts, ultra-low contact resistance, suitable for long-term high and low temperature stress testing
④ Aging life: ≥1000H x 5 cycles, suitable for continuous reliability testing on HTOL/HAST/Burn-in mass production lines
⑤ Contact resistance: ≤50mΩ, ensuring accurate signal transmission under high current/high humidity environments
