BGA2532
AI Chips
Test Socket
Coaxial metal design, zero crosstalk‖PEEK & ceramic materials, million-cycle durability‖Micron-level pin control, constant resistance
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Full-Scenario Test Solutions
Covering ATE functional testing and reliability testing scenarios, precisely matching various chip package needs
Precision Builds Quality
Precision Manufacturing
Contact resistance stably controlled within 50mΩ.
Fast Custom Delivery
From requirement to sample delivery in as fast as 7 working days.
Global Service Network
Covering China, Taiwan, Japan, Korea and Southeast Asia.
Full Package Coverage
Supporting BGA, QFN, LGA, SOP, DIP, QFP and more.
Strict Quality Control
ISO 9001 certified, 100% electrical testing.
Expert Technical Team
Core team with 10+ years of industry experience.
Latest Insights
【LPDDR6 Global First Mass Production | CXMT × Xiaomi 18 Fold Ushers in a New Era of High-End Storage】
CXMT's self-developed LPDDR6 has achieved the world's first mass production, debuting in the Xiaomi 18 Fold foldable flagship. Utilizing a 1295-ball POP stacked package, it boasts a peak bandwidth of 12800Mbps, facilitating the deployment of edge AI computing power and breaking the overseas monopoly on high-end storage. KLD has completed the development of its BGA1295 LPDDR6 high-speed test socket ahead of schedule. Its micron-level precision contacts support tens of thousands of durability tests, ensuring high-speed signal integrity. KLD provides a full-process chip verification and aging test solution, empowering collaborative innovation across the domestic semiconductor storage industry chain with customized reliable testing solutions.
CXMT LPDDR6 Mass Production Imminent | 1295Ball POP Packaging Testing Solution Empowers Domestic Memory
CXMT LPDDR6 is about to enter mass production, with comprehensive upgrades in performance and reliability. Kailidi adapts its 1295Ball POP package, providing high-speed, stable, and full-scenario customized BGA test socket solutions.
