BGA2532
AI Chips
Test Socket
Coaxial metal design, zero crosstalk‖PEEK & ceramic materials, million-cycle durability‖Micron-level pin control, constant resistance
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Full-Scenario Test Solutions
Covering ATE functional testing and reliability testing scenarios, precisely matching various chip package needs
Precision Builds Quality
Precision Manufacturing
Contact resistance stably controlled within 50mΩ.
Fast Custom Delivery
From requirement to sample delivery in as fast as 7 working days.
Global Service Network
Covering China, Taiwan, Japan, Korea and Southeast Asia.
Full Package Coverage
Supporting BGA, QFN, LGA, SOP, DIP, QFP and more.
Strict Quality Control
ISO 9001 certified, 100% electrical testing.
Expert Technical Team
Core team with 10+ years of industry experience.
Latest Insights
CXMT LPDDR6 Mass Production Imminent | 1295Ball POP Packaging Testing Solution Empowers Domestic Memory
CXMT LPDDR6 is about to enter mass production, with comprehensive upgrades in performance and reliability. Kailidi adapts its 1295Ball POP package, providing high-speed, stable, and full-scenario customized BGA test socket solutions.
Customized BGA576-1.0 Test Socket Solution | High and Low Temperature Mass Production Testing Solution for FPGA/DSP Chips
Customized Infrared Detector Test Mount Solution | Solving the Challenges of High and Low Temperature Mass Production Testing for Uncooled Infrared Chips
Customized solution for infrared detector test socket | Solving the challenge of high and low temperature mass production testing for uncooled infrared chips With the rapid development of infrared imaging, vehicle-mounted night vision, industrial temperature measurement, and security optoelectronic industries, the requirements for testing accuracy and stability of infrared focal plane detectors and uncooled infrared detection chips continue to rise. These optoelectronic chips often adopt ceramic and metal professional packaging, and rely on precise array light-sensing structures to work. They have extremely high requirements for the optical path transparency of the test fixture, the alignment accuracy of the probe, and environmental adaptability. Common test fixtures are prone to issues such as false measurements, poor contact, and low yield rates. As a professional semiconductor test socket manufacturer, Kailidi Technology has deep expertise in the field of optoelectronic chip testing. We have launched a dedicated infrared detector test socket specifically for infrared probe testing scenarios. Our products are compatible with various infrared focal plane arrays, R&D verification of optoelectronic detection chips, high and low temperature screening, ATE mass production testing, and other full-process scenarios. Relying on five core advantages: precise customization, ultra-high precision, ultra-high yield, stable performance, and professional technical services, we can provide personalized mold customization according to chip packaging structure, array arrangement, and optical testing requirements, taking into account both optical path transparency and electrical signal transmission, significantly reducing testing errors. Kailidi has always provided high-stability test interface solutions to serve optoelectronic chip design enterprises and packaging and testing manufacturers, effectively improving the efficiency of mass production testing and yield rate of finished products for infrared chips, and providing reliable guarantees for the reliability testing of optoelectronic semiconductors. Consultation hotline: 13798558026 Email: jasmine@fcssemi.com Company address: Room 208, Liutang Building, Xixiang Street, Bao'an District, Shenzhen