In the ultimate challenge of chip reliability verification—HTOL and HAST testing—sockets face not just high temperature and humidity, but the severe tests of high current, dynamic power, and prolonged electrical stress. We specialize in providing customized reliability test interfaces for high-power AI/GPU chips and automotive-grade semiconductors. For HTOL, we tackle the critical issues of thermal management under high heat flux​ and contact electromigration under high current, ensuring stable contact resistance over thousands of hours of aging. For HAST, we employ specialized cavity sealing designs, corrosion-resistant materials, and internal temperature/humidity balance control​ to withstand extreme conditions exceeding 130°C and 85% RH. Whether your chip requires dynamic frequency aging, multi-site parallel testing, or complex thermomechanical simulation, we provide a complete engineering solution from structural design to mass production validation, safeguarding your product's reliability.