With the iterative upgrades of communication technology, industrial control, and high-end embedded devices, the mass production testing standards for high-end chips such as multi-core DSPs, industrial FPGAs, and communication SoCs are becoming increasingly stringent. BGA576-1.0, as a mainstream package specification in the industry, adopts a 1.0mm ball pitch and a 24×24mm/25×25mm array arrangement, covering mainstream PBGA and FCBGA processes. With its high-density pins and high-performance transmission advantages, it is widely used in high-end industrial control and communication fields. These high-density BGA chips have extremely high requirements for test socket alignment accuracy, contact stability, and high and low temperature tolerance. Conventional test fixtures are prone to problems such as mistesting, poor contact, and low test yield.


KLD Technology, as a professional semiconductor test socket customization manufacturer, has deep expertise in the BGA chip testing field and has launched a dedicated BGA576-1.0 test socket, fully adaptable to the R&D verification, high and low temperature aging screening, and ATE mass production testing needs of various BGA576 packaged chips. Our products leverage five core advantages: precise customization, ultra-high precision, ultra-high yield, stable performance, and professional technical services. They can be customized to suit specific chip package sizes, array structures, and testing conditions, precisely matching high-density solder ball alignment requirements, effectively mitigating testing errors, and ensuring continuous and stable operation under complex high and low temperature conditions.

For a long time, Kailidi has focused on providing chip design companies and semiconductor packaging and testing manufacturers with highly adaptable and reliable BGA test interface solutions, effectively improving the testing efficiency and mass production yield of high-end BGA chips, and laying a solid foundation for semiconductor chip reliability testing.

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