Product Details

I. Product Overview

The KLD BGA1024 ATE mass production test socket is designed specifically for 1024 ball BGA packaged chips and is suitable for ATE mass production testing of high-end FPGAs, microprocessors (MPUs), AI accelerators, and other chips. The product supports full-process customization from design verification to mass production testing and has been widely used in network digital energy, new energy vehicle electronics, big data centers, and other fields.

II. Structural Design

Item Specifications Applicable Package BGA1024 (33mm × 33mm package size)

Pin Pitch 0.65mm / 1.0mm optional

Structure Type Clamshell / Open Top, compatible with automated and manual operation

Mounting Method Through-hole soldering / Screw fixing

Design Features: Optional floating plate design effectively protects the chip under test (DUT) while providing better contact. Supports customized ATE machine interfaces, adaptable to mainstream sorting machines and testing systems.

III. Core Materials

Component Materials Test Socket Body PEEK ceramic / Torlon 4203 / PEI / PPS and other high-performance engineering plastics

Socket Head Aluminum alloy (AL) or copper alloy (Cu), balancing conductivity and mechanical strength

Probe Contacts Beryllium copper alloy, gold-plated + nickel-plated process

Material selection ensures dimensional stability and insulation performance over a wide temperature range, meeting the high-intensity requirements of mass production testing.

IV. Probe System

Item Specifications

Probe Type Spring Probe, individually replaceable

Single pin spring force 20g ~ 30g, ensuring stable contact pressure

Contact Method Four-wire Kelvin detection optional, supporting precision resistance measurement

The replaceable probe design significantly reduces maintenance costs; a single probe failure does not require replacing the entire test socket.

V. Mechanical Life

Test Item Specifications

Mechanical Life ≥30,000 cycles

Operating Temperature -55°C ~ +175°C

Lifespan Note: Probe lifespan is affected by factors such as the testing environment, chip pin material, and operating procedures. Kailidi can customize optimization solutions according to customer mass production cycles to extend effective lifespan.

VI. Electrical Performance

Parameter Specifications Contact Resistance ≤50mΩ (typical value)

Rated Current Maximum 2A/pin

Bandwidth ≥20GHz @ -1dB

Insulation Resistance ≥1,000MΩ @ DC 500V Low contact resistance and high bandwidth characteristics ensure signal transmission integrity, avoiding additional testing errors that affect yield assessment.

VII. Yield Assurance Mechanism

Low and stable contact resistance: A typical value of ≤50mΩ ensures that the test signal is not affected by contact impedance, reducing yield loss due to misjudgments.

High-precision machining: The flatness of the probe card/test socket pad area is controlled to ≤50μm, ensuring consistency in simultaneous contact of multiple pins.

Maintainability: Probes can be replaced individually, avoiding the scrapping of the entire socket due to single-point contact failure, ensuring production continuity.

VIII. Customized Services

With over 15 years of engineering and technical capabilities, Kailidi provides full-process customized support:

Chip package size and pin definition matching design

Test socket structure (Clamshell / Open Top / Dedicated for automated machines)

Probe selection (based on frequency, current, and impedance requirements)

Complete solutions including burn-in boards/load boards/test kits

IX. Application Scenarios

R&D Verification: Engineering verification and debugging after chip tape-out

ATE Mass Production Testing: Used with sorters and testers for functional and performance screening during chip mass production

Burn-in Testing: Adapted to high-temperature aging environments, accelerating the exposure of early failures

X. Quality and Service

KLD possesses complete capabilities in electronic circuit development, software development, mechanical 3D design, and system integration. Adhering to the philosophy of "Quality, Technology, Innovation, and Win-Win," the company provides customers with one-stop testing solutions from R&D to mass production, covering high-end fields such as semiconductors, network digital energy, new energy vehicle electronics, aerospace, and military industries.